FLEX AND CHIP ON FLEX
FLEX-HDI • BUMPLETS • MILITARY
Compunetics’ track record of excellence in flex and chip on flex
products is unparalleled in the industry.
Our quality has earned us the role as a major presence in the commercial and military flex market, a regular choice for new material beta testing, and the company of choice when customers require the development of new products. Compunetics’ flex boards are used for a variety of applications including:
• Chip testing
• High energy physics
Compunetics’ design and manufacturing teams are all under one roof for constant collaboration.
Our flex features include:
• Variety DuPont adhesiveless materials
• Beta site for “all-polyimide” bondply product
• Wedge/ball bonding gold surface
• 2 mil (50 µm) trace/space
• Ticer TCR resistors on flex
• Small-to-medium volume
• Quick turn capability