MICROVIAS & FINE LINES
BLIND • BURIED • LASER DRILLED • 25 MICRONS
Compunetics is the vendor of choice when requirements
include very high density interconnects.
• Laser microvias as small as 1 mil (25 µm)
• In-house YAG laser
• Mechanical drilled
• Stacked and stepped microvias
Compunetics is a pioneer in very high density circuitry. Fine lines are produced using the latest generation photoresist resulting in circuits as small as 1 mil (25 µm).
Compunetics microvias and fine line circuitry is the perfect fit for applications including:
• Chip packaging
• High density flex connectors