Firecomms, a global leader in the optical component industry, is pleased to announce the appointment of Dylan Loughnan as the company’s new Field Applications Engineering Manager for the Americas.
As the company’s primary technical resource for the growing Americas market, Loughnan will support customers in the development of fiber optic solutions. The company’s customers — from a wide variety of markets including industrial automation, transportation, medical imaging, renewable energy and home networking — will benefit from his expertise with the company’s portfolio of fiber optic transceivers and related solutions.
“As a senior member of the engineering and technical staff, Dylan has been involved in all aspects of the development of Firecomms product roadmap as well as providing advanced technical support to our customers,” says Lawrence Thorne, Firecomms’ Vice President of Sales & Marketing, The Americas. “Having a strong technical resource close at hand will benefit our customers in this region.”
Loughnan, based in Boston, has been with Firecomms for over four years, most recently as a Sr. Product Design Engineer. He has an advanced physics degree from Cork Institute of Technology (CIT) with graduate research experience at Massachusetts Institute of Technology (MIT).
About Firecomms Ltd.
Firecomms, a global leader in the provision of fiber optic solutions and optical transceivers, skilfully combines state-of-the-art compound and silicon semiconductor technology with inventive small-scale integration to develop products that drive communications networks in power and energy, industrial, transportation, medical and consumer markets.
Firecomms is jointly headquartered in Cork, Ireland and Tongxiang, China with additional facilities in the USA, Shanghai and Southeast Asia. To learn more about how Firecomms can help your business, please visit www.firecomms.com.
May 16, 2016 By
Printed Electronics Market is one of the fastest growing markets that follow the global trend of miniaturization. It concerns different industries as various as consumer goods, robotics, medical, lighting, wearable technologies and many others.
Today companies face a challenge to find solutions to reduce weight, space and costs of their components to create innovative electronic devices. In low frequency signal transfers, wire to board and wire to wire connections are usually used. But how can they ensure a good assembly solution?
Some electronic components companies have discrete wire to flat connection solutions that suit the current demand. The main advantage of this kind of solution are the weight saving and security of connection features.