CHIP CARRIERS & MULTI-CHIP MODULES
HDI • MULTI-TIERED CAVITY • MCM-L
Compunetics excels in customized products and prototypes
that can be produced in small runs with fast turnaround.
These products can combine many of these valuable features:
• High density
• Buried resistors
• Multi-tiered cavity
• Edge plating
• 2 mil (50 µm) trace/space
• Heat spreader
• Aluminum wedge or gold ball wirebond surface
• Flip chip
• Low-to-moderate volume
• Quick turnaround
Applications include:
• Digital imaging, including real-time x-ray
• Global Positioning Satellite (GPS) Systems
• Handheld applications
• Custom chip packaging
• Military, including: Smart Weapons &
Undersea Ordinates
• IC Testing
• High speed computing
• Fiber optic networks