MICROVIAS & FINE LINES

MICROVIAS & FINE LINES

MICROVIAS & FINE LINES BLIND • BURIED • LASER DRILLED • 25 MICRONS Compunetics is the vendor of choice when requirements include very high density interconnects. Microvia specifications: • Laser microvias as small as 1 mil (25 µm) • In-house YAG laser • Mechanical...
HIGH SPEED MATERIALS

HIGH SPEED MATERIALS

HIGH SPEED MATERIALS MICROWAVE • RF • HIGH SPEED DIGITAL A full range of dielectric high speed materials to suit any application. Compunetics has a reputation for excellence in precision imaging, tight etch tolerances and laser cutting. Because our products operate...
BURIED PASSIVES

BURIED PASSIVES

BURIED PASSIVES RESISTORS • CAPACITORS • BULK CAPACITANCE Compunetics is a recognized pioneer in the design and manufacture of superior quality buried passives. With our design and production departments all at one location, Compunetics has an environment of energized...
FLEX AND CHIP ON FLEX

FLEX AND CHIP ON FLEX

FLEX AND CHIP ON FLEX FLEX-HDI • BUMPLETS • MILITARY Compunetics’ track record of excellence in flex and chip on flex products is unparalleled in the industry. Our quality has earned us the role as a major presence in the commercial and military flex market, a regular...
CHIP CARRIERS & MULTI-CHIP MODULES

CHIP CARRIERS & MULTI-CHIP MODULES

CHIP CARRIERS & MULTI-CHIP MODULES HDI • MULTI-TIERED CAVITY • MCM-L Compunetics excels in customized products and prototypes that can be produced in small runs with fast turnaround. These products can combine many of these valuable features: • High density •...