MICROVIAS & FINE LINES
BLIND • BURIED • LASER DRILLED • 25 MICRONS

Compunetics is the vendor of choice when requirements
include very high density interconnects.

Microvia specifications:
• Laser microvias as small as 1 mil (25 µm)
• In-house YAG laser
• Mechanical drilled
• Stacked and stepped microvias

Fine lines:
Compunetics is a pioneer in very high density circuitry. Fine lines are produced using the latest generation photoresist resulting in circuits as small as 1 mil (25 µm).
Compunetics microvias and fine line circuitry is the perfect fit for applications including:

• Supercomputing
• Military
• Medical
• Telecommunications
• Chip packaging
• High density flex connectors

HIGH SPEED MATERIALS

MICROWAVE • RF • HIGH SPEED DIGITAL

A full range of dielectric high speed materials to suit any application.

Compunetics has a reputation for excellence in precision imaging, tight etch tolerances and laser cutting. Because our products operate reliably and exactly as expected, Compunetics is the vendor of choice for clients with demanding applications including:

• Satellite communications
• Radar
• Wireless communications
• High speed networking

Currently, Compunetics uses:
• Rogers, Arlon, Taconic
• DuPont TK
• LCP (Liquid Crystal Polymer)
• Nelco Si Series
• W.L. Gore Speedboard “C” Series
• GETEK
• BiAc Liquid Crystal Flex

BURIED PASSIVES
RESISTORS • CAPACITORS • BULK CAPACITANCE

Compunetics is a recognized pioneer in the design and
manufacture of superior quality buried passives.

With our design and production departments all at one location, Compunetics has an environment of energized collaboration, innovation and attention to detail.

Products include:
• Laser-trimmed resistors
• Resistors on flex
• RC networks
• Bulk capacitance

Compunetics is regularly at the forefront of next generation technologies, regularly collaborating with vendors of new materials and serving frequently as a beta site.

Applications include:
• Internet servers
• Satellite communications
• Cellular telephone networks
• High Speed Probing

FLEX AND CHIP ON FLEX

FLEX-HDI • BUMPLETS • MILITARY

Compunetics’ track record of excellence in flex and chip on flex
products is unparalleled in the industry.

Our quality has earned us the role as a major presence in the commercial and military flex market, a regular choice for new material beta testing, and the company of choice when customers require the development of new products. Compunetics’ flex boards are used for a variety of applications including:

• Military
• Medical
• Aerospace
• Chip testing
• High energy physics

Compunetics’ design and manufacturing teams are all under one roof for constant collaboration.

Our flex features include:
• Single/Double/Multilayers
• Variety DuPont adhesiveless materials
• Beta site for “all-polyimide” bondply product
• Wedge/ball bonding gold surface
• 2 mil (50 µm) trace/space
• Ticer TCR resistors on flex
• Small-to-medium volume
• Quick turn capability

CHIP CARRIERS & MULTI-CHIP MODULES

HDI • MULTI-TIERED CAVITY • MCM-L

Compunetics excels in customized products and prototypes
that can be produced in small runs with fast turnaround.

These products can combine many of these valuable features:
• High density
• Buried resistors
• Multi-tiered cavity
• Edge plating
• 2 mil (50 µm) trace/space
• Heat spreader
• Aluminum wedge or gold ball wirebond surface
• Flip chip
• Low-to-moderate volume
• Quick turnaround

Applications include:
• Digital imaging, including real-time x-ray
• Global Positioning Satellite (GPS) Systems
• Handheld applications
• Custom chip packaging
• Military, including: Smart Weapons &

Undersea Ordinates
• IC Testing
• High speed computing
• Fiber optic networks